Infineon Technologies AG acquired Siltectra GmbH, a start-up based in Dresden. The start-up has developed an innovative technology (Cold Split) to process crystal material efficiently and with minimal loss of material. Infineon will use the Cold Split technology to split silicon carbide wafers, thus doubling the number of chips out of one wafer. A purchase price of €124m was agreed on with the venture capital investor MIG Fonds, the main shareholder. “This acquisition will help us expand our excellent portfolio with the new material silicon carbide as well. Our system understanding and our unique know how on thin wafer technology will be ideally complemented by the Cold Split technology and the innovative capacity of Siltectra. Thanks to the Cold Split technology, the higher number of SiC wafers will make the ramp-up of our SiC products much easier, especially regarding further expansion of renewable energies and the increasing adaptation of SiC for use in the drive train of electrical vehicles.” Dr. Reinhard Ploss Infineon CEO.