Maverick, a fund management company, and Translink Capital, a venture capital firm, led a $23m Series A round in Thintronics, an electronic materials startup. “To satisfy the explosive growth in demand for high performance compute, AI datacenters will need to incorporate faster data transfer speeds and wider bandwidth, while improving on power consumption and signal integrity. This is a formidable challenge that requires material redesign across all levels of the interconnect fabric, and we believe that Thintronics’ innovation in insulator film is a fundamental substrate-level enabler as AI servers adopt 224G standards and beyond. Additionally, Thintronics domestically sources all its components, and we believe this is a crucial step in onshoring advanced packaging technologies and ensuring that supply chains are vertically integrated in the US," Kenny Safar, Maverick Capital Partner.