TCV led a $23m Series B round in Cloudsmith.

TCV, an American investment firm, led a $23m Series B round in Cloudsmith, a cloud-native artifact management platform, with participation from Insight Partners, MMC, Frontline, Techstart, Sorenson, Tapestry, and Shasta. “The way software is built is fundamentally changing, making artifact management mission-critical for developers, cybersecurity professionals, and platform engineers alike. Enterprises need real-time observability, security, and control over their software supply chain. This new investment will help us to keep scaling up to meet the needs of the world’s largest and most complex organizations,” Glenn Weinstein, Cloudsmith CEO.